Plasma thinning of silicon-on-insulator bonded wafers
- 31 August 1993
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 22 (1-4) , 347-350
- https://doi.org/10.1016/0167-9317(93)90184-7
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Rapid, Nonmechanical, Damage-Free Figuring Of Optical Surfaces Using Plasma-Assisted Chemical Etching (PACE): Part I Experimental ResultsPublished by SPIE-Intl Soc Optical Eng ,1989