Abstract
A novel vertical Hall magnetic field sensor which incorporates two important microsensor features is presented. First, the device is fabricated using a standard complementary metal oxide semiconductor (or CMOS) process and therefore possesses all characteristics inherent with integrated circuitmanufacturing. Second, the magnetic field sensor is subjected to a post‐processing step which involves CMOS‐compatible micromachining techniques. This combination of micromachining and CMOS processing led to the superior results for a micromachined sensor when compared with a non‐micromachined magnetic field sensor.

This publication has 12 references indexed in Scilit: