Influence of the exchange reaction on the electronic structure of GaN/Al junctions

Abstract
Ab initio full-potential linearized augmented plane-wave (FLAPW) calculations have been used to study the influence of the interface morphology and, notably, of the exchange reaction on the electronic properties of Al/GaN (100) interfaces. Although the detailed mechanism is not understood, the exchange reaction has been purported to influence the Schottky barrier height (SBH) as a result of the formation of an interfacial GaxAl1xN layer. In particular, the effects of interface structure (i.e., interfacial bond lengths, semiconductor surface polarity, and reacted intralayers) on the SBH at the Al/GaN (001) junction are specifically addressed. Thus, the electronic structure of the following atomic configurations have been investigated theoretically: (i) an abrupt, relaxed GaN/Al interface; (ii) an interface that has undergone one monolayer of exchange reaction; and interfaces with a monolayer-thick interlayer of (iii) AlN and (iv) Ga0.5Al0.5N. The exchange reaction is found to be exothermic with an enthalpy of 0.1 eV/atom. We find that the first few layers of semiconductor are metallic due to the tailing of metal-induced gap states; therefore, the presence of a monolayer-thick interfacial alloy layer does not result in an enhanced band gap near the interface. Intermixed interfaces are found to pin the interface Fermi level at a position not significantly different from that of an abrupt interface. Our calculations also show that the interface band lineup is not strongly dependent on the interface morphology changes studied. The p type SBH is reduced by less than 0.1 eV if the GaN surface is Ga terminated compared to the N terminated one. Moreover, we show that both an ultrathin GaxAl1xN (x=0, 0.5) intralayer and a GaAl atomic swap at the interface do not significantly affect the Schottky barrier height.