Interaction between helium bubbles and migrating grain boundaries in copper
- 31 August 1971
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 19 (8) , 807-813
- https://doi.org/10.1016/0001-6160(71)90137-4
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
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- Sweeping of bubbles by grain boundaries in irradiated UCJournal of Nuclear Materials, 1967
- Grain boundary mobility and its effects in materials containing inert gasesPhilosophical Magazine, 1964
- Self-Diffusion in CopperPhysical Review B, 1954