Thermal studies on finned LSI packages using forced convection
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 753-756
- https://doi.org/10.1109/33.49043
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Thermal Management of Electronic Equipment: A Review of Technology and Research TopicsApplied Mechanics Reviews, 1986
- Numerical and Experimental Study of Turbulent Heat Transfer and Fluid Flow in Longitudinal Fin ArraysJournal of Heat Transfer, 1986
- Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983