Predicting Failure Stress of Silicon Nitride Ceramics Using Microfocus Radiography

Abstract
Microfocus projection radiography was used to evaluate nondestructively a large quantity of silicon nitride modulus‐of‐rupture test bars. Quantitative data (size, shape, and location) on major naturally occurring voids in rejected bars were determined from radiographs. Failure stress prediction was attempted using a fracture mechanics model and nondestructive evaluation data and compared to actual failure stress.

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