The role of sequential processes in the hot pressing of copper/alumina
- 1 April 1976
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 24 (4) , 277-283
- https://doi.org/10.1016/0001-6160(76)90001-8
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- The second stage sintering kinetics of powder compactsActa Metallurgica, 1975
- Grain-Boundary Sliding and Axial Strain during Diffusional CreepMetal Science, 1975
- On grain boundary sliding and diffusional creepMetallurgical Transactions, 1971
- The Influence of Alumina Dispersions on the Diffusion-Creep Behaviour of Polycrystalline CopperMetal Science Journal, 1971
- The role of grain-boundary sliding in high-temperature creepMaterials Science and Engineering, 1968
- Pressure Sintering: Mechanisms and Microstructures for Alumina and MagnesiaJournal of the American Ceramic Society, 1963
- Hot‐Pressing Alumina—Mechanisms of Material TransportJournal of the American Ceramic Society, 1963
- High‐Pressure Hot‐Pressing of Uranium Carbide Powders and Mechanism of Sintering of Refractory BodiesJournal of the American Ceramic Society, 1962
- Hot‐Pressing of Alumina Powders at Low TemperaturesJournal of the American Ceramic Society, 1961
- Self-Diffusion in CopperPhysical Review B, 1954