Modeling and experimental studies on thermosonic flip-chip bonding
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (4) , 728-733
- https://doi.org/10.1109/96.475282
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Analysis of impedance loading in ultrasonic transducer systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Timoshenko beam finite elements using the assumed modes methodJournal of Sound and Vibration, 1992
- Dynamics of an ultrasonic bonding tool: A case study in p‐version finite‐element analysisThe Journal of the Acoustical Society of America, 1991
- Forced vibrations of a beam including dry friction dampersComputers & Structures, 1989