AES/ESCA/SEM/EDX Studies of Die Bond Materials and Interfaces

• 1 April 1984
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
• No. 07350791,p. 169-174
• https://doi.org/10.1109/irps.1984.362039

Abstract

Keywords

• BONDING
• SILICON
• MICROASSEMBLY
• PREFORMS
• GOLD
• AEROSPACE MATERIALS
• TEMPERATURE
• MICROELECTRONICS
• PACKAGING
• FAILURE ANALYSIS