Improvement of sidewall roughness in deep silicon etching

• 9 February 2000
• journal article
• research article
• Published by Springer Nature in Microsystem Technologies
• Vol. 6  (3) , 86-89
• https://doi.org/10.1007/s005420050003

Abstract

Keywords

• SILICON
• ASPECT RATIO
• TRENCH
• ETCH RATE
• INNOVATIVE APPROACH