Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules
- 30 November 1996
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 39 (16) , 3519-3529
- https://doi.org/10.1016/0017-9310(96)00014-2
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Impingement Cooling of ElectronicsJournal of Heat Transfer, 1992
- Convective heat transfer response to height differences in an array of block-like electronic componentsInternational Journal of Heat and Mass Transfer, 1984
- Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic componentsInternational Journal of Heat and Mass Transfer, 1983
- Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipmentInternational Journal of Heat and Mass Transfer, 1982