Dielectric Monitoring of the Bonding Process
- 1 October 1981
- journal article
- research article
- Published by Taylor & Francis in The Journal of Adhesion
- Vol. 12 (4) , 317-331
- https://doi.org/10.1080/00218468108071209
Abstract
The changes in the dielectric properties of a curing thermoset adhesive can be correlated with the chemical and rheological changes that occur during the cure. The progress towards the use of these real time events to control the bonding process is discussed. The primary mathematical relationships are described, the influence of chemical structure is discussed, monitoring under shop conditions is demonstrated and a correlation between the dielectric signal, heat of reaction and wetting angle is developed for a specific adhesive.Keywords
This publication has 1 reference indexed in Scilit:
- Cross‐checking between dielectric measurements, DTA, and other methods of thermal analysis in research and productionJournal of Applied Polymer Science, 1972