Inhibition of the underpotential deposition of copper on single crystalline platinum surfaces
- 10 January 1992
- journal article
- Published by Elsevier in Journal of Electroanalytical Chemistry
- Vol. 322 (1-2) , 279-288
- https://doi.org/10.1016/0022-0728(92)80082-f
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
- Metal-metal interfacial bonding: monolayer c(2 × 2) Cu on a Pt(001) surfaceSurface Science, 1991
- In-plane structural and electronic characteristics of underpotentially deposited copper on gold (100) probed by in-situ X-ray absorption spectroscopyJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1990
- In-situ, real time monitoring of electrode surfaces by scanning tunneling microscopyJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1989
- The influence of anions on the structure of underpotentially deposited Cu on Au(111): A LEED, RHEED and AES studyBerichte der Bunsengesellschaft für physikalische Chemie, 1987
- Ordered overlayer of lead obtained by underpotential deposition on Pt(100)Surface Science, 1987
- Underpotential deposition of lead on single crystal faces of goldJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1984
- Underpotential Metal Deposition on Single Crystal SurfacesZeitschrift für Physikalische Chemie, 1980
- Copper monolayer formation on platinum single crystal surfaces: Optical and electrochemical studiesSurface Science, 1979
- Potentiodynamic desorption spectra of metallic monolayers of Cu, Bi, Pb, Tl, and Sb adsorbed at (111), (100), and (110) planes of gold electrodesSurface Science, 1976
- Linear voltage sweep polarography of Ag+ at stationary silver electrodesJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1969