Inductive contamination analysis (ICA) with SRAM application
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 552-560
- https://doi.org/10.1109/test.1995.529883
Abstract
This paper proposes a new simulation-based fault modeling methodology. The methodology-an extension of Inductive Fault Analysis-uses the contamination-defect-fault simulator CODEF to directly relate effects of process-induced contamination to circuit-level malfunctions. The application of this methodology (called Inductive Contamination Analysis) is demonstrated by development of SRAM fault models Author(s) Khare, J. Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA Maly, W.Keywords
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