Thermal Chip Evaluation of IC Packaging

• 1 September 1972
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
• Vol. 8  (3) , 39-44
• https://doi.org/10.1109/tphp.1972.1136572

Abstract

Keywords

• IC PACKAGING
• EVALUATION OF IC
• THERMAL CHIP EVALUATION