Modeling of particle arrangement in an isotropically conductive adhesive joint
- 5 December 2005
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components and Packaging Technologies
- Vol. 28 (4) , 765-770
- https://doi.org/10.1109/tcapt.2005.859671
Abstract
An isotropically conductive adhesive (ICA) is a composite material consisting of a nonconductive polymer binder and conductive filler particles. When the filler content is high enough the nonconductive binder is transformed into a good electrical conductor. This transition can be described by the percolation theory. We present a two-dimensional model to analyze the principal influences of the geometrical and electrical properties of the filler particles on the percolation threshold and the electrical resistance of an ICA joint. With this model, the arrangement of the particles within the joint is calculated by considering different types of forces. Taking into account the electrical properties of the particles, the electrical contact behavior is investigated. The goal of this study is to provide a deeper understanding of the changes of the macroscopic contact behavior due to different environmental impacts.Keywords
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