An Experimental Investigation of the Film-to-Substrate Bond Strength of Sputtered Thin Film Using a Semi-Quantitative Test Method

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Abstract
The experimentally measured adhesion strength of thin films of titanium and titanium nitride deposited on aluminum and AISI 304 stainless steel substrates are reported. A semi-quantitative test method presented and discussed in a companion paper was used to measure the film-to-substrate bond strength. The test results obtained show that the surface cleaning and preparation procedures used prior to film deposition dominate thin film adhesion. The results obtained also show that thin soft and hard films with film-to-substrate bond strength sufficient for heavily loaded tribological applications can be produced with magnetron sputtering techniques.

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