A Simple Method of using the Die of an Integrated Circuit to Measure the Relative Humidity Inside its Encapsulation

Publisher Website

1 April 1980

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium

https://doi.org/10.1109/irps.1980.362907

Abstract

No abstract available

This publication has 0 references indexed in Scilit: