Intermetallic Growth and Contact Resistance of Tin Contacts After Aging
- 1 March 1976
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 12 (1) , 33-39
- https://doi.org/10.1109/tphp.1976.1135097
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- A model for the spontaneous growth of zinc, cadmium and tin whiskersActa Metallurgica, 1976
- Contact Properties of Tin PlatesIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Base Metal Contacts: An Exploratory Study of Separable Connection to Tin-LeadIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its AlloysTransactions of the IMF, 1973
- The Interaction of Some Atmospheric Gases with a Tin-Lead AlloyJournal of the Electrochemical Society, 1973
- On the crystal orientation of electrodeposited metalsElectrochimica Acta, 1964
- Effects of Diffusion from Brass Substrates into Electrodeposited Tin Coatings on Corrosion Resistance and Whisker GrowthTransactions of the IMF, 1963
- The Selection of Finishes for Communication EquipmentTransactions of the IMF, 1961
- The Solderability of Some Tin, Tin Alloy and Other Metallic CoatingsTransactions of the IMF, 1959