Low moisture polymer adhesive for hermetic packages
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (6) , 964-971
- https://doi.org/10.1109/33.206918
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Silicone die bond adhesive and clean in-line cure for copper lead frameIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Low stress silver-glass die attach materialsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990