Evidence of Aggregation-Induced Copper Immobilization During Polyimide Metallization

• 1 November 1998
• journal article
• research article
• Published by Wiley in Advanced Materials
• Vol. 10  (16) , 1357-1360
• https://doi.org/10.1002/(sici)1521-4095(199811)10:16<1357::aid-adma1357>3.0.co;2-9

Abstract

Keywords

• BEHAVIOR
• ALUMINUM
• COPPER
• PACKAGING
• CHIP
• MINIATURIZATION
• POLYIMIDE
• STIMULATED
• GREAT