Thermoelectric power of homovalent copper alloys. (Oxidation)

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Abstract
An oxidation technique has been used to remove traces of iron from copper-gold and copper-silver alloys and the low temperature thermoelectric power of these homovalent copper alloys has been used to study the success of the oxidation procedure. The electron diffusion and phonon drag contributions to thermoelectric power characteristic to the scattering from silver and gold impurities in copper are determined and discussed. The strongly positive diffusion thermoelectrical powers determined at low temperatures differ dramatically from the negative impurity contributions derived on the basis of the Nordheim-Gorter rule from room temperature measurements of alloys.