Thermal Stress in Epoxy Molding Compounds and Packaged Devices

• 5 September 1989
• book chapter
• Published by American Chemical Society (ACS)
• p. 344-355
• https://doi.org/10.1021/bk-1989-0407.ch028

Abstract

Keywords

• STRESS
• PLASTIC
• THERMOMECHANICAL
• MOLDING COMPOUNDS
• PACKAGED DEVICES
• THERMAL
• EPOXY