The Kinetics of Tungsten Etching by Atomic and Molecular Chlorine

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Abstract
The reactions of atomic and molecular chlorine with tungsten were studied by modulated beam‐mass spectrometric methods over the temperature range 300–1350 K. The atomic beam was generated by an RF plasma discharge. With both atomic and molecular beams, the main reaction product up to about 1000 K was . The reaction probability with atomic chlorine was a factor of approximately ten higher than that obtained with molecular chlorine. The reaction was nonlinear with respect to intensity at low beam fluxes but approached linearity at high beam intensities. Above 1000 K the main reaction product was atomic chlorine. Its reaction probability increased rapidly with temperature; at 1300 K nearly complete dissociation of was observed. A kinetic model based on the Eley‐Rideal mechanism was proposed and compared with the data.

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