Measurement of Electroless Plating Rate by Coulostatic Method

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Abstract
The copper deposition rate in a production electroless copper plating bath was measured by the coulostatic method. The effects of the substrate material and the degree of bath aging on the measured parameters were investigated. The deposition current density , obtained from weight gain data of the specimen, the double layer capacity , and the polarization resistance measured by this method depended on the substrate material, while the proportionality constant for conversion from to was almost constant. The dependence of , , and on the substrate material was interpreted in terms of the surface roughness of the substrate. The possibility of using this method for real time monitoring of electroless deposition rates was demonstrated by these results.

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