A Bilevel Thin Film Hybrid Circuit Containing Crossovers, Resistors, Capacitors, and Integrated Circuits
- 1 September 1973
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 9 (3) , 181-185
- https://doi.org/10.1109/tphp.1973.1136722
Abstract
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