Ball grid array solder joint failure envelope development for dynamic loading
- 28 September 2004
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 10, 1067-1074
- https://doi.org/10.1109/ectc.2004.1319472
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
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- Effect of circuit board flexure on flip chips before underfillPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Soil mechanics and plastic analysis or limit designQuarterly of Applied Mathematics, 1952