The yield stress of polycrystalline thin films
- 1 February 1993
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 8 (2) , 237-238
- https://doi.org/10.1557/jmr.1993.0237
Abstract
In recent experiments it has been shown that the yield stress of polycrystalline thin films depends separately on the film thickness and the grain size. It was also shown that the grain size dependence varies as the reciprocal of the grain size. In this paper an analysis is presented which leads to these results and provides a more detailed understanding of the origins of the observed behavior.Keywords
This publication has 2 references indexed in Scilit:
- Effects of grain orientation on hillock formation and grain growth in aluminum films on silicon substratesScripta Metallurgica et Materialia, 1992
- Separation of film thickness and grain boundary strengthening effects in Al thin films on SiJournal of Materials Research, 1992