Chemical mechanical polishing of copper for multilevel metallization
- 1 October 1995
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 91 (1-4) , 192-196
- https://doi.org/10.1016/0169-4332(95)00118-2
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper StructuresJournal of the Electrochemical Society, 1994
- Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical PolishingMRS Bulletin, 1993
- Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturingThin Solid Films, 1992