Estimating high speed circuit interconnect performance
- 1 April 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Circuits and Systems
- Vol. 36 (4) , 533-541
- https://doi.org/10.1109/31.92885
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Copper/polyimide Materials System for High Performance PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Characteristics of Coupled MicrostriplinesIEEE Transactions on Microwave Theory and Techniques, 1979
- Alternating-Current Resistance of Rectangular ConductorsProceedings of the IRE, 1937