Cu deposition on Al2O3 and AlN surfaces: Electronic structure and bonding
- 15 September 1987
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 62 (6) , 2286-2289
- https://doi.org/10.1063/1.339485
Abstract
We report a photoelectron spectroscopy study of the interaction of copper with Al2O3 and AlN model systems processed under ultrahigh vacuum conditions and compared the intrinsic electronic interactions between the two cases. The evolution of the electronic structure and bonding of Cu to AlN has been further studied using ab initio total energy pseudofunction techniques.This publication has 8 references indexed in Scilit:
- Electronic structure of AlNPhysical Review B, 1986
- Chemisorptive bonding of carbon monoxide on nickel (001): Formulation and application of a new pseudofunctional electron muffin tin approachApplied Physics A, 1986
- Pseudofunction method: Application to a monolayer of CO and to the Si(111) surfacePhysical Review B, 1986
- Structural and electronic properties of a carbon monoxide monolayerSolid State Communications, 1986
- Photoelectron and electron energy loss spectra of epitaxial aluminum nitrideSolid State Communications, 1985
- Molecular-orbital model for metal-sapphire interfacial strengthJournal of Applied Physics, 1982
- Reaction of N2+ beams with aluminum surfacesThe Journal of Chemical Physics, 1981
- Explicit local exchange-correlation potentialsJournal of Physics C: Solid State Physics, 1971