Transient thermal analysis of solid-state power devices Making a dreaded process easy

1 June 1975

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 234-251
https://doi.org/10.1109/pesc.1975.7085587

Abstract

In spite of its importance in the rating and reliable application of power diodes and thyristors, the computation of instantaneous junction temperature has been a poorly understood and generally dreaded process among equipment designers. Under many practical circumstances, it has only been feasible by means of lengthy computer programs.

Keywords

IMPEDANCE
SILICON
TRANSIENT ANALYSIS
TEMPERATURE MEASUREMENT
JUNCTIONS
THERMAL ANALYSIS
THERMAL CONDUCTIVITY

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