The effect of electronic energy loss on the dynamics of thermal spikes in Cu
- 1 March 1991
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 6 (3) , 483-491
- https://doi.org/10.1557/jmr.1991.0483
Abstract
We present results of a molecular dynamics simulation study of the effect of electron-ion interactions on the dynamics of the thermal spike in Cu. Interatomic forces are described with a modified embedded atom method potential. We show that the electron-ion interaction acts to reduce the lifetime of the thermal spike and therefore the amount of atomic rearrangement that takes place in energetic displacement cascades in Cu. The results point toward the important effect that inelastic energy losses might have on the dynamics of displacement cascades in the subcascade energy regime where the lifetime of the thermal spike is expected to exceed the electron-phonon coupling time.Keywords
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