On the thermal stability of thin Cu overlayers on Ni (111)
- 1 September 1981
- journal article
- Published by Taylor & Francis in Philosophical Magazine Part B
- Vol. 44 (3) , 327-331
- https://doi.org/10.1080/01418638108223555
Abstract
The stability against heating of thin Cu overlayers (up to four monolayers, θ ≤ 4) on Ni(111) has been studied with ultraviolet photoelectron spectroscopy (hv = 21.2 eV) and LEED. A comparison is made of the stabilities of one monolayer and of the thin overlayer (θ ≃ 1.5–2) left on the substrate after Cu agglomeration induced at θ = 4 by treatment at 450°C. This last overlayer involved also in the Stranski–Krastanov growth is much more stable than one monolayer; we discuss the role of the clusters in this effect.Keywords
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