Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components
- 1 September 1991
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 113 (3) , 244-249
- https://doi.org/10.1115/1.2905402
Abstract
Use of modal testing and structural dynamic modification techniques for prediction of the modal parameters of a PC board with a surface-mount component is described. Experimentally determined natural frequencies and mode shapes of a PC board with and without an added component are presented. Several simple dynamic models of the component are evaluated. Results obtained indicate that the component can sometimes be modeled as a point mass.Keywords
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