A future technology for silicon wafer processing for ULSI

• 1 October 1991
• journal article
• Published by Elsevier in Precision Engineering
• Vol. 13  (4) , 251-255
• https://doi.org/10.1016/0141-6359(91)90002-z

Abstract

Keywords

• PLASTIC-REGIME GRINDING
• CREEP-FEEDING
• IN-FEEDING
• SILICON WAFERING PROCESS
• ELECTROLYTIC DRESSING
• RESIDUAL DAMAGE
• SURFACE GRINDING
• SILICON WAFER