Thermal Resistance: A Reliability Consideration

• 1 December 1980
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
• Vol. 3  (4) , 580-587
• https://doi.org/10.1109/tchmt.1980.1135666

Abstract

Keywords

• THERMAL RESISTANCE
• INTEGRATED CIRCUIT
• THERMAL MODEL
• RELIABILITY CONSIDERATION
• TEMPERATURE
• PLASTIC PACKAGE