Recent Progress in Silicon Photonics R&D and Manufacturing on 300mm Wafer Platform

1 January 2015

proceedings article
Published by Optica Publishing Group

p. W3A.1
https://doi.org/10.1364/ofc.2015.w3a.1

Abstract

A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.

Keywords

GRATING COUPLERS
OPTICAL DIRECTIONAL COUPLERS
OPTICAL SYSTEMS
OPTICAL TESTING
PHASE SHIFT
SILICON PHOTONICS

This publication has 1 reference indexed in Scilit:

Copper pillar interconnect capability for mmwave applications in 3D integration technology
Microelectronic Engineering, 2013