Effects of Fe, Ni and Sn on Reaction Diffusion at Solder/Cu-Base-Alloys Interface
Open Access
- 1 January 1984
- journal article
- Published by Japan Institute of Metals in Journal of the Japan Institute of Metals and Materials
- Vol. 48 (9) , 863-870
- https://doi.org/10.2320/jinstmet1952.48.9_863
Abstract
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