Analysis of microvia interconnects
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 3, 1925-1928
- https://doi.org/10.1109/mwsym.1998.700959
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modelingIEEE Transactions on Microwave Theory and Techniques, 1997
- Characterization of high frequency interconnects using finite difference time domain and finite element methodsIEEE Transactions on Microwave Theory and Techniques, 1994
- Application of the three-dimensional finite-difference time-domain method to the analysis of planar microstrip circuitsIEEE Transactions on Microwave Theory and Techniques, 1990