Novel deposit/spin waveguide interconnection (DSWI) technique for semiconductor integrated optics

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Abstract
We propose an efficient and simple optical interconnection between active semiconductor components by deposition and spin coating. The demonstration shows a low-threshold (2.0 kA/cm2) and high-coupling (81%) operation of a laser-polyimide/SiO2 slab waveguide integrated on a GaInAsP/InP chip.