Bond testing enters mainstream PCB assembly

• 29 February 1996
• journal article
• Published by Elsevier in Microelectronics Journal
• Vol. 27  (1)
• https://doi.org/10.1016/s0026-2692(96)90018-x

Abstract

Keywords

• PACKAGING
• SEMICONDUCTOR
• BONDING
• PROCEDURES
• CHIP
• PCB
• TAB
• CHECKING
• MAINSTREAM
• FLIP