New, creep-resistant, low melting point solders with ultrafine oxide dispersions
- 1 November 1998
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (11) , 1216-1222
- https://doi.org/10.1007/s11664-998-0072-9
Abstract
No abstract availableKeywords
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