Optical and Auger Microanalyses of Solder Adhesion Failures in Printed Circuit Boards

• 1 February 1981
• journal article
• Published by The Electrochemical Society in Journal of the Electrochemical Society
• Vol. 128  (2) , 379-383
• https://doi.org/10.1149/1.2127425

Abstract

Keywords

• PRINTED CIRCUIT BOARD