A new philosophy for interconnection on multilayer boards

1 January 1976

proceedings article
Published by Association for Computing Machinery (ACM)

p. 225-231
https://doi.org/10.1145/800146.804818

Abstract

Alternative approaches to the interconnection problem on multilayer boards are studied and evaluated with respect to their desirability and feasability. A brief review of the current methodology is included to highlight those aspects of the current approach that might be improved upon. The conclusion is that a more integrated approach to interconnection on multilayer boards is essential to deriving the maximum benefit from the additional degrees of freedom afforded by a multilayer board. Various such integrated approaches are proposed.

Keywords

INTEGRATED APPROACH
NEW PHILOSOPHY
CURRENT METHODOLOGY
ALTERNATIVE APPROACH
MAXIMUM BENEFIT
INTERCONNECTION PROBLEM
CURRENT APPROACH
MULTILAYER BOARD
BRIEF REVIEW
ADDITIONAL DEGREE
CIRCUIT DESIGN
DEGREE OF FREEDOM

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