Electroceramics

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Abstract
Structure-property relationships in electronic ceramic materials are reviewed to provide insight into the behaviour of capacitors, thermistors, varistors, and other electroceramic components. Rapid progress in the integration and miniaturisation of ceramic components has led to the development of multipurpose electronic packages containing complex three-dimensional circuitry. At the same time, a wide variety of smart sensors, transducers, and actuators are being constructed utilising composite materials to concentrate fields and forces. At present the processing methods make use of tape casting the thick film techniques, but several upset technologies loom on the horizon. During the years ahead one can expect electroceramic devices to follow in the footsteps of semiconductor technology as the component sizes drop below 1 mu m, and nanocomposite devices become a reality.

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