Effect of the Type of Substrates on the Ductility and Microstructure of Electroless Copper Deposits
- 1 February 1993
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 140 (2) , 533-538
- https://doi.org/10.1149/1.2221082
Abstract
The ductility of fine‐grained electroless copper deposits was found to vary with the type of substrates that they were plated on; under identical plating conditions, the ductility of the electroless copper grown on activated plastic substrates was higher than that grown epitaxially on a large‐grained copper foil. This ductility difference is shown to originate from a difference in the void structure developed at the grain boundaries of the deposits during film formation.Keywords
This publication has 0 references indexed in Scilit: