The Use of Bismuth Alloy Systems for Reflow and Wave Soldering
- 1 January 1992
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 4 (1) , 23-26
- https://doi.org/10.1108/eb037776
Abstract
In view of the increasing interest in low temperature and lead‐free solder alloys, a review was made of existing information on the physical properties of bismuth alloys suitable for electronic bonding applications, by reflow and wave soldering. A comparison was made, where possible, with existing tin‐lead alloys already in widespread use, with new information experimentally derived where none was currently available.Keywords
This publication has 1 reference indexed in Scilit:
- Application of MTDATA to the Modeling of Multicomponent EquilibriaPublished by Springer Nature ,1990