Preliminary investigation has demonstrated that surface morphology of epitaxial copper electrodeposits is influenced by the anion of the electrolyte. Effects due to the use of sulfate, sulfamate, dimethylsulfamate, methane‐sulfonate, benzene‐sulfonate, perchlorate, fluoborate, nitrate, chloride, and acetate anions were studied. Observed changes in surface structural details are consistent with adsorption of the anion on the cathode as an important influencing factor, but other factors can and do produce similar results.