Pulse Propagation Properties of Multilayer Ceramic Multichip Modules for VLSI Circuits
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4) , 480-484
- https://doi.org/10.1109/tchmt.1983.1136208
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Coupled Lossy Transmission Line Characterization and SimulationIBM Journal of Research and Development, 1981
- IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and DensityIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
- Transmission Properties of Various Styles of Printed Wiring BoardsBell System Technical Journal, 1979
- Calculation of Coefficients of Capacitance of Multiconductor Transmission Lines in the Presence of a Dielectric InterfaceIEEE Transactions on Microwave Theory and Techniques, 1970